First International Workshop on Advanced Patterning Solutions (IWAPS) held on October 12-13, 2017 was a great success with a record number of 21 speakers and over 200 attendees from around the world. This workshop was held under the auspices of the Integrated Circuit Industry Technology Innovation Alliance in China (ICTIA), undertaken by Institute of Microelectronics of Chinese Academy of Science (IMECAS) and sponsored by SMIC, YMTC, Huahong Group, Mentor, ASML, KLA Tencor, Nata, SMEE, Synopsys, Toppan, JSR, DJEL and KINGSEMI.
At the beginning of the workshop, Jianlin Cao (president of IWAPS, chairman of ICTIA, former vice minister of Ministry of Science and Technology) , Junru Ma (the former director of the Bureau of the State Administration of Foreign Experts) and Gang Qiu (deputy inspector of Key Special Affairs Office of Ministry of Science and Technology, vice director of 02 Special Implementation Management Office) made the opening speech for the workshop successively. Tianchun Ye, vice president of IWAPS and director of IMECAS, made an analysis report about current industry trends.
Secretary general of IWAPS Yayi Wei who is also the director of Computational Lithography R&D Center in IMECAS presided over the opening ceremony. Professors, fellows, managers and engineers from intel, IBM, Qualcomm, AMD, ASML, SMIC and so on were invited to make reports about computational lithography technology toward 7nm and below, SMO, DTCO, EUV, DSA, Design rules, Advanced Lithography Material, lithography equipment, etc.
The Workshop provides an environment where leading researchers and engineers from various disciplines in patterning can share their thoughts and ideas. The speakers at the Workshop are selected by invitation only and represent a broad range of disciplines and covering a wide array of different lithography approaches and requirements. Presentations are arranged to be comprehensive, covering the current practice, the future trend and the challenges ahead. The Workshop format is to provide an atmosphere for in-depth discussions among the attendees. This workshop also provides an opportunity for researchers and engineers who want to know more about the semiconductor R&D and business opportunity in China.
The 2nd International Workshop on Advanced Patterning Solutions (IWAPS) came to a successful close on October 19th, 2018. The two-day workshop was held under the auspices of Integrated Circuit Industry Technology Innovation Alliance in China (ICTIA), organized by Institute of Microelectronics of Chinese Academy of Science (IMECAS) and Xiamen Semiconductor Investment Group Co., Ltd, co-organized by Chinese Optical Society. Sponsors of the workshop included SMIC, YMTC, Huahong Group, Mentor, ASML, Photronics, KLA-Tencor, Nata, SMEE, Synopsys, Toppan, CYMER, JSR, DJEL, TEL, DOW, and ZEISS. More than 300 guests attended the workshop, all of whom came from distinguished enterprises and research institutions based in China, the U.S., Germany, Japan, etc. In accordance with the arrangement, the specially-invited guests made their reports on the proposed themes. After the workshop, a group photo of the participants was taken for commemoration.
To get the reports of IWAPS 2018, please click here "IWAPS 2018 Report Download".
IWAPS-2019 Program
Group Photo could be download here -- IWAPS2019GroupPhoto.jpg.
Cite: Author Name, "Presentation Title," the 3rd International Workshop on Advanced Patterning Solutions (IWAPS2019), Nanjing China, 17-18, Oct, 2019.
| No | Author | Presentation Title | Download |
| Day1-AM-1 | Patrick Naulleau (Lawrence Berkeley National Lab) | EUV Lithography: Current Status and Remaining Challenges |
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| Day1-AM-2 | Jeongdong Choe (TechInsights) | Technology Views on 3D NAND Flash: Current and Future | IWAPS2019-1-A2-JeongdongChoe.pdf |
| Day1-AM-3 | Jo Finders (ASML) | EUV lithography: update on scanner and infrastructure progress |
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| Day1-AM-4 | Hiromitsu Maejima (TEL) | Coater/Developer System Latest Technology | IWAPS2019-1-A4_HiromitsuMaejima.pdf |
| Day1-AM-5 | Keita Sakai (Canon) | Latest status of nanoimprint system for semiconductor device manufacturing |
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| Day1-PM-1 | Ilhami Torunoglu, Liang Cao (Mentor) | ML Platform and applications | IWAPS2019-1-P1_IlhamiTorunoglu.pdf |
| Day1-PM-2 | Chris Spence (ASML Brion) | OPC Model Accuracy and Roadmap | IWAPS2019-1-P2_ChrisSpence.pdf |
| Day1-PM-3 | Xiangyu Zhou (Synopsys) |
Resolving mask correction challenges on implant layers ——Topography-aware rigorous flow deployment in advanced device manufacturing |
IWAPS2019-1-P3_XiangyuZhou.pdf |
| Day1-PM-4 | Zhiyang Song (YMTC) | OPC Modeling with Image Processing on 3D NAND Via Layer |
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| Day1-PM-5 | Bin Zhao (HLMC) | Development & mass production management of sub-20nm half pitch with ArF immersion and SADP process |
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| Day1-PM-6 | Wei Yuan (Shanghai IC R&D Center) | Machine Learning SRAF improves OPC Performance at 1X node and below |
IWAPS2019-1-P6_WeiYuan.pdf |
| Day2A-AM-1 | Henry Kamberian (Photronics) | Mask Pattern Fidelity Considerations in EUV Mask Technology |
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| Day2A-AM-2 | Rolf Seltmann (Zeiss) | Improving Chip Performance by Photomask Tuning: Ultimate Mask CD control as a major part of an overall excursion prevention strategy |
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| Day2A-AM-3 | Tommy Oga (Gigaphoton) | Next generation ArF lightsource “GT65A” for cutting-edge immersion lithography providing both improvement on availability and performance | IWAPS2019-2A-A3_TommyOga.pdf |
| Day2A-AM-4 | Will Conley (Cymer) | Multi-focal imaging for improved depth of focus: principles and application to ArF Immersion Lithography |
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| Day2A-AM-5 | Qiang Wu (Shanghai IC R&D Center) | The Photolithography Process Design for 5 nm Logic Process Flow | IWAPS2019-2A-A5_QiangWu.pdf |
| Day2A-AM-6 | Lisong Dong (IMECAS) | Source optimization and mask defect compensation by EUV lithography simulation |
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| Day2A-PM-1 | Yanxiang Liu (Hisilicon) | Patterning challenges and DTCO for the fast product ramp-up at 14/12nm technology node |
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| Day2A-PM-2 | Wenzhan Zhou (HLMC ) | DFM: “Design for Manufacturing” or “Design Friendly Manufacturing” |
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| Day2A-PM-3 | Liang Cao (Mentor) | Machine Learning Platform in DTCO |
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| Day2A-PM-4 | Liang Zhu (Synopsys) | A Study of 2D Assist Feature Placement |
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| Day2A-PM-5 | Yushu Yang (Shanghai IC R&D Center) | Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography |
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| Day2A-PM-6 | Yu Ding (Shanghai IC R&D Center) | The Device Design for 5 nm Logic Process Flow |
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| Day2B-AM-1 | Kevin Huang (KLA) | Future patterning challenges: It’s not 2D, it’s 3D | IWAPS2019-2B-A1_KevinHuang.pdf |
| Day2B-AM-2 | Abhishek Vikram (Anchor Semiconductor) | More Efficient Patterning Defect Inspection and Metrology - Advancing the Current Capability |
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| Day2B-AM-3 | Andrew Zhang (YMTC) | Metrology challenges in 3D NAND flash technical development and manufacturing |
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| Day2B-AM-4 | Xiaoye Ding (YMTC) | White light Interference Solution for High Performance 3D NAND VIA Dishing Metrology |
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| Day2B-AM-5 | Takanori Kawakami (JSR) | Advanced Lithography Material Status toward 5nm Node and beyond |
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| Day2B-AM-6 | Dimitrios Kazazis (Paul Scherrer Institute) | Extreme ultraviolet interference lithography for high-resolution patterning and resist testing |
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| Day2B-AM-7 | Vincent Chen (Pibond) | Enabling silicon-based materials for advanced and novel semiconductor manufacturing processes |
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| Day2B-AM-8 | Huayong Hu (Jiangsu Hantop) | Photoresist Product Development at Jiangsu Hantop Photomaterial Company | IWAPS2019-2B-A8_HuayongHu.pdf |
| Day2B-PM-1 | Shengxiang Ji (Changchun Institute of Applied Chemistry, CAS) | Directed Self-assembly of High-X Block Copolymers on Chemical Patterns for Sub-10 nm Patterning |
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| Day2B-PM-2 | Deqiang Wang (Chongqing Institute of Green and Intelligent Technology, CAS) | Fabrication 2D/3D nanopore with Helium Ion Microscope for DNA sequencing |
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| Day2B-PM-3 | Hai Deng (Fudan University) | Development of High Resolution Advanced Lithographic Patterning Materials |
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| Day2B-PM-4 | Huigao Duan (Hunan University) | Sketch and Peel Lithography for Multiscale Patterning |
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| Day2B-PM-5 | Yanqing Wu (Shanghai Advanced Research Institute) | EUV lithography resist testing and nano-periodic structure fabrication based on SSRF-XIL station: application and prospects | IWAPS2019-2B-P5_YanqingWu.pdf |
| Day2B-PM-6 | Xiaolong Wang (Paul Scherrer Institute) | Second order diffraction EUV interference lithography for the study of high-resolution EUV resists | IWAPS2019-2B-P6_XiaolongWang.pdf |
| Day2B-PM-7 | Meng Su (Institute of Chemistry, CAS) | Self-assembling of Nanomaterials via Droplet Manipulation for Multi-dimensional Micro/nanostructures |
|
IWAPS-2020 Program
The full-length papers have been published in IEEE Xplore: https://ieeexplore.ieee.org/xpl/conhome/9286788/proceeding
You can download the Program Agenda of IWAPS-2020 here: IWAPS2020ProgramAgenda.pdf
Group Photo could be downloaded here -- IWAPS2020GroupPhoto.zip
Cite: Author name(s), "Presentation title," the 4th International Workshop on Advanced Patterning Solutions (IWAPS-2020), Chengdu China, 5-6 Nov, 2020.
The public presentation files could be download here: IWAPS2020_PublicPresentations_download
IWAPS-2021 Program Agenda (IWAPS2021ProgramAgenda.pdf)
The proceedings have been published in IEEE Xplore.
Conference Group Photo (IWAPS2021GroupPhoto) (Note: It is recommended to open the website with Firefox or IE and download the presentations)
Cite: Author(s), "Presentation title," the 5th International Workshop on Advanced Patterning Solutions (IWAPS-2021), Foshan China, 12-13 Dec., 2021.
The public presentation files could be download here: IWAPS2021_PublicPresentations_download
此处下载IWAPS-2021会议通知
IWAPS-2022 Program Agenda (IWAPS2022ProgramAgenda.pdf)
The proceedings have been published in IEEE Xplore. (https://ieeexplore.ieee.org/xpl/conhome/9971792/proceeding)
Conference Online Video (IWAPS2022_OnlineVideo) (https://www.koushare.com/topicLive/i/IWAPS2022)
Cite: Author(s), "Presentation title," the 6th International Workshop on Advanced Patterning Solutions (IWAPS-2022), Beijing China, 21-22 Oct., 2022.
The public presentation files could be download here: IWAPS2022_PublicPresentations_download
IWAPS-2023 Program Agenda (IWAPS2023ProgramAgenda.pdf)
The proceedings have been published in IEEE Xplore. (https://ieeexplore.ieee.org/xpl/conhome/10365714/proceeding)
Conference Group Photo (IWAPS2023GroupPhoto) (Note: It is recommended to open the website with Firefox or IE and download the presentations)
Cite: Author(s), "Presentation title," the 7th International Workshop on Advanced Patterning Solutions (IWAPS-2023), Lishui China, 25-26 Oct., 2023.
The public presentation files could be download here: IWAPS2023_PublicPresentations_download
