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IWAPS2022-P-01_Relationship between Normalized Image Log Slope and Exposure Latitude in advanced technodes_ Xie Weimei

IWAPS2022-P-02_On-product Overlay Improvement for a Back-End-of-Line Immersion Layer_Guoping Liu

IWAPS2022-P-03_Frequency doubling and resolution enhancement technique exploration for chrome-less phase shift mask_Liang Li

IWAPS2022-P-04_Resolution improvement review for the immersion lithography_Miao Jiang

IWAPS2022-P-06_Aberration Control Method of Parasitic Force for Ultra-Low Aberration Lithography Lens_WANG Dong-ping

IWAPS2022-P-07_Position tracking control of an ultra-precision servo system_Xin Zhou

IWAPS2022-P-08_New Classification Method-Use Optical Inspection Tool to Establish Haze Library_Yilei Zeng

IWAPS2022-P-11_DRAM Word-line bottom roughness detection using BSE signal_ Linghai Liu

IWAPS2022-P-12_Study on defocus image-based template matching algorithm for EUV mask blank phase defect detection_Xiaoquan Han

IWAPS2022-P-13_Process window analysis of post OPC SRAF placement_GuangZhao

IWAPS2022-P-16_ Uniformity of device performance improvement for the SOT-MRAM by optimizing the lithography process at 200-mm wafer manufacturing platform_Bowen Man

IWAPS2022-P-19_Designing high quality test chips with improved coverage for design rule exploration, process variation improvement and hotspot discovery_Yining Chen

IWAPS2022-P-20_SONR based layout decomposition and applications_Rui Xu

IWAPS2022-P-21_Source optimization for anamorphic magnification high-numerical aperture extreme ultraviolet lithography based on thick mask model_Chengcheng Wang

IWAPS2022-P-22_High efficiency graded multilayer coating design using least-square fitting for NA0.55 extreme ultraviolet lithography Objective_Xiaonan Zhong

IWAPS2022-P-23_Strategy-Oriented Exact Pattern Grouping Approaches for Integrated Circuit Designs_Yuan Gan

IWAPS2022-P-24_Mask Bias optimization for NTD lithography process_Liwan Yue

IWAPS2022-P-25_Measurement and Calculation Method for Sub-20 nm Line and DSA Patterns_Chi Yang

IWAPS2022-P-26_Enhanced Super-resolution Imaging by Bilayer Aluminum Superlens in DUV Photolithography_Jing WANG

IWAPS2022-P-27_A ViaContact Layout Decomposition Method for Directed Self-Assembly Based on Local Optimization_Hengyu Zhou

IWAPS2022-P-28_Accurate and Efficient Proximity Effect Correction for Electron Beam Lithography Based on Multilayer Perceptron Neural Network_Wenze Yao

IWAPS2022-P-30_SEM contour extraction application on contact edge roughness_Xiao Yang

IWAPS2022-P-32_Optimal OPC model selection with SEM image contours_Zhen-Fei Zheng

IWAPS2022-P-34_Lithography Hotspot Detection Based on Yolov5_Qingyue Wu

IWAPS2022-P-35_Mask 3D model based on complex-valued convolution neural network for EUV lithography_Chengzhen Yu